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Evaluation of antibacterial and biofilm activity of copper oxide nanoparticles in soft denture liner against oral pathogens

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Document pages: 7 pages

Abstract: Goals. Denture soft lining provides a good environment for microbial adhesion and colonization. The purpose of this in vitro study was to detect the effect of different concentrations of copper oxide nanoparticles (CuO NPs) added to soft denture pad on biofilm formation of microbial species. method. Field emission scanning electron microscopy (FESEM) images of NPs were recorded. Antifungal susceptibility tests of five standard Candida albicans (CBS 10261, 1905, 1912, 1949, 2730), Streptococcus mutans (atcc35668), Streptococcus sobrinus (atcc27607) and Streptococcus salivarius (atcc9222) to CuO NP were carried out by broth microdilution method and reference methods of clinical and Laboratory Standards Institute. Biofilm inhibition of percntages of CuO NPs on the soft denture liners were determined by XTT assay. Results. The characterization of CuO NPs by scanning electron microscope (SEM) analyses confirmed the synthesis of NPs with appropriate structure and size with a mean diameter of 18.3 ± 9.1 nm. The CuO NPs successfully inhibited the growth of the tested standard strains of C. albicans and Streptococcus spp. at concentrations ranging from 64 to 128 µg mL−1. Indeed, incorporation of CuO NPs at a concentration of 500 µg mL−1 into the soft denture liners exhibited a significant activity (75 ) in inhibition of C. albicans. biofilm formation in a dose-dependent manner. The biofilm formation of C. albicans in the presence of CuO NPs was lower than Streptococcus spp. in comparison with the control group (). Conclusion. Incorporation of CuO NPs significantly decreased the colonization and plaque formation of the oral pathogens, especially C. albicans accumulation. These NPs may be useful as a promising agent for the antimicrobial management of soft denture liner materials.

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