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Effect of nano zinc oxide on properties of SAC0307 lead-free solder paste

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Document pages: 10 pages

Abstract: The effects of different concentrations of zinc oxide (ZnO) nanoparticles (0.0, 0.25, 0.50, 0.75 and 1.0) on the melting temperature, wettability, printability, slump and weight percentage of interface microstructure of sn-0.3ag-0.7cu lead-free solder paste doped with ZnO on copper substrate were investigated. The results show that the introduction of ZnO particles has no effect on the solidus and liquidus temperatures of solder. The maximum wettability

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