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Gate Optimization Analysis of Injection Molding for Mobile Phone Panel Based on Moldflow and Drop Simulation

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Document pages: 8 pages

Abstract: Aiming at the gate design of mobile phone panel, the gate design is optimized by plastic forming analysis software Moldflow and drop simulation. Six different gate design schemes are compared and studied, and the weld position and injection molding results under each gate scheme are analyzed. The drop process of mobile phone panel is simulated and analyzed by displaying the dynamic analysis software ANSYS Workbench LS-DYNA. Five analysis schemes are set according to the drop angle, and the stress distribution of mobile phone panel weld position under each scheme is studied. By synthesizing the stress conditions of mobile phone panel, die flow analysis and drop simulation results, a reasonable gate scheme is givenuse. Based on the results of die flow analysis and drop simulation the optimal gate design scheme 2 is found, and the weld line position avoids the lower part of the elliptical hole, which is the weak part of the structure. The research results had certain reference significance for the optimization of injection process of plastic products.

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