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A Development of Innovative Shape Memory Polymers and Their Nanocomposites to Resist the Load Aircraft High Lift Devices

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Document pages: 22 pages

Abstract: In the present world, conventional materials are failed in the fatigue and corrosive loads when carrying the heavyweight. The current research has discussed the development of new Shape Memory Polymers (SMP) and their nanocomposites for high-stress concentrated structural parts in the industrial components. Our development of innovative Shape Memory Polymer (SMP), Shape Memory Polymer Composites (SMPC), and Shape Memory Polymer Nano-Composites (SMPNC) can be useful to optimize from triangular, hexagonal, honeycomb structured panels which are easily deformed and withstand in all loading conditions. Poly Lactic Acid (PLA), Acrylonitrile Butadiene Styrene (ABS) plastics, Glass Fiber Reinforced Polymer (GFRP) are the SMP materials used. Carbon Fiber composite is used as an interlayer to increase the strength of Shape Memory Polymer (SMP) materials. For better strengthening and flexibility, nanographene material is also used, which results in SMPNCs. These materials are validated for Boeing 777 and Airbus A380 Aircraft High Lift device applications using Finite Element Methodology (FEM) of SMP and SMPNC. For 3D modeling of the Aircraft wing with high lift devices, CATIA V5 software is utilized. ANSYS Workbench Software R15 is used for Fluid Solid Interface (FSI) Analysis

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