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Patterned Nickel Interlayers for Enhanced Silver Wetting, Spreading and Adhesion on Ceramic Substrates

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Document pages: 19 pages

Abstract: The metal current collectors used in electronic, energy conversion, and energy storage devices often have difficulty wetting and adhering to ceramic substrates. Here, a novel Particle Interlayer Directed Wetting and Spreading (PIDWAS) technique is demonstrated that utilizes 1) the low wetting angle of silver on nickel and 2) the high work of adhesion between nickel and various ceramics to produce well-adhered, self-assembled silver patterns on ceramics not normally wet by silver. This is achieved by partially sintering nickel patterns and melt infiltrating either 1) locally-applied silver or 2) silver that simultaneously dewets the ceramic and laterally spreads through the porous nickel network. The resulting Ag-Ni patterns have higher sapphire adhesion strengths, higher densities, and similar electronic resistivities to those made using commercially-available silver circuit pastes. Further, these dense Ag-Ni patterns can be produced without the need for externally-applied pressure, making them desirable for circuit, sealing, die-attach, joining and other applications.

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